The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 1987

Filed:

May. 03, 1985
Applicant:
Inventors:

Hiroshi Takeda, Kanagawa, JP;

Noritsugu Oshima, Kanagawa, JP;

Tateo Kubo, Hiratsuka, JP;

Kenichi Sakaguchi, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ; B29C / ;
U.S. Cl.
CPC ...
425297 ; 425345 ; 4253 / ; 425361 ; 425408 ; 425576 ;
Abstract

A compression molding apparatus comprising a rotary compression molding means, a material feed means and an article carrying means. The rotary compression molding means includes a rotating supporting member mounted rotatably about its central axis, a plurality of molding die means mounted on said rotating supporting member at circumferentially spaced intervals, each of said molding die means having an upper die assembly and a lower die assembly cooperating with each other, at least one of upper die assembly and lower die assembly being freely movable with respect to the other, a driving source for rotating said rotating supporting member in a predetermined direction and moving said molding die means through a circular conveying passage including a material charging zone, a molding zone, a cooling zone and an article discharging zone located successively, and a die opening and closing means for moving at least one of said upper and lower die assemblies in a predetermined manner with respect to the other according to the movement of the molding die means.


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