The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 1986

Filed:

Dec. 17, 1984
Applicant:
Inventors:

Masaki Morikawa, Iwatsuki, JP;

Hideaki Yoshida, Kasukabe, JP;

Kunio Kishida, Ohmiya, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C / ; C22C / ;
U.S. Cl.
CPC ...
420479 ; 420480 ; 420471 ; 420473 ; 420481 ; 420482 ;
Abstract

A Cu alloy having high resistance to oxidation for use in leads on semiconductor devices is disclosed. The alloy consists essentially of 7-15 wt % Mn, 10-30 wt % Zn, 0.2-10 wt % Ni, 0.1-3 wt % Al, with the balance being Cu and incidental impurities. Also disclosed is a Cu alloy clad material wherein the substrate is made of Cu or Cu alloy having high electrical conductivity and good heat dissipation, and the cladding or partial cladding is composed of the Cu alloy having the composition specified above.


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