The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 1986

Filed:

Jul. 25, 1985
Applicant:
Inventors:

Akio Tsumura, Osaka, JP;

Shun-ichi Hayashi, Osaka, JP;

Chiharu Miyaake, Osaka, JP;

Kazuo Oouchi, Osaka, JP;

Yutaka Yamamura, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
156584 ; 156344 ; 430256 ;
Abstract

A peeling type developing method and apparatus for removing exposed photoresist from printed circuit boards. The printed circuit board is covered with a photopolymerization compound layer and then a transparent support layer. After exposure, a thin adhesive tape is stuck to the support layer extending obliquely across the board and crossing opposite corners thereof. The adhesive tape, together with the support layer and the unexposed portions of the photoresist material, are peeled off the printed circuit board by a pair of pinch rolls with the aid of a peeling bar in line contact with the substrate through the adhesive tape and the support layer.


Find Patent Forward Citations

Loading…