The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 1986

Filed:

Apr. 25, 1985
Applicant:
Inventors:

Franz Haas, Sr, Vienna, AT;

Franz Haas, Jr, Leobendorf, AT;

Johann Haas, Klosterneuburg, AT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A21C / ; A21D / ;
U.S. Cl.
CPC ...
426501 ; 426138 ; 426514 ;
Abstract

In a process of making a rolled wafer cone from a baked flat wafer blank made from a sugar-containing wafer dough, the baked wafer blank is rolled to form a wafer cone in a winding mold while the wafer blank is still in a soft, deformable state after the baking operation. Thereafter the rolled wafer cone is permitted to harden. In order to ensure the production of wafer cones having consistently exactly the same shape, it is proposed that the wafer cone which is unrestrained at least in part is shortened in the winding mold to a predetermined length while the wafer cone is adapted to be plastically deformed. For this purpose the rolled wafer cone disposed in the winding mold is subjected to a plastic deformation only at one end or only at both ends. The process can be carried out by means of winding devices, which are mounted on a rotary frame and each of which comprises a conical winding core, which is secured to a winding shaft that is displaceable relative to the rotary frame to move the conical winding into and out of the winding mold. In that apparatus each winding device is provided with at least one sizing device, which is associated with the rim of the wafer cone and comprises at least one pressure-applying finger, which is adapted to be introduced between the winding mold and the winding core.


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