The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 1986
Filed:
Mar. 19, 1984
Applicant:
Inventor:
Raymond S Enochs, Hillsboro, OR (US);
Assignee:
Tektronix, Inc., Beaverton, OR (US);
Primary Examiner:
Int. Cl.
CPC ...
H01R / ;
U.S. Cl.
CPC ...
339 / ; 339174 ; 361398 ;
Abstract
A pressure interconnect package for connecting an integrated circuit chip to an etched circuit board comprising a pressurized stack of circuit elements in which a flexible interconnecting circuit is disposed between the IC chip and the etched circuit board to cause them to make electrical contact upon the application of pressure to the stack.