The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 1986
Filed:
Sep. 27, 1983
Applicant:
Inventors:
Kiyoshi Hisatomi, Yokohama, JP;
Masaburo Iwabuchi, Yokohama, JP;
Assignee:
Tokyo Shibaura Denki Kabushiki Kaisha, Kawasaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; B44C / ;
U.S. Cl.
CPC ...
156645 ; 5128 / ; 156636 ; 156639 ; 156662 ; 156903 ;
Abstract
The edge part of a thin disc-shaped slice, i.e., wafer, transversely cut off a single-crystal semiconductor rod is bevel machine, and then the entire surface of this wafer is mirror finished. This mirror finish is obtained by carrying out chemical etching to the ordinary depth and then carryng out polishing by means of a polishing fabric. By this process, all surfaces of the semiconductor wafer are polished to a mirror finish, and the formation of dendrite crystals on any of the surfaces is inhibited.