Apparatus for continuously making an endless wafer laminate of uniform

Abstract

Process and apparatus for continuously making an endless wafer laminate which has a uniform width and consists of individual wafer sheet layers and intervening cream layers. In order to increase the production rate of such wafer laminate while maintaining a high quality, the invention teaches that each edge of the wafer sheets for the lowermost wafer sheet layer is registered and the deposition of the wafer sheets for the remaining wafer sheet layers is controlled by the succession of said wafer sheet edges. The butt joints of the wafer sheets in the individual wafer sheet layers are offset relative to each other in the direction of conveyance or are arranged exactly in register. For registering the wafer sheet edges, the edges of consecutive wafer sheets are displaced or pivotally moved relative to each other or pulled apart to form a gap. Each wafer sheet for the additional wafer sheet layers is moved to a waiting position in the wafer sheet applicator, which succeeds the coating head for applying a cream layer, and in dependence on the succession of the wafer sheet edges of the lowermost wafer sheet layer is applied to the adjacent cream layer and is then forced against the same. The resulting wafer laminate is used as an intermediate product for making small wafer slices.