The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 1986

Filed:

Sep. 24, 1981
Applicant:
Inventors:

Yoshitada Oshida, Fujisawa, JP;

Hiroshi Makihara, Yokohama, JP;

Nobuhiko Aoki, Yokohama, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B / ;
U.S. Cl.
CPC ...
356381 ; 250201 ;
Abstract

A plate thickness measuring method and apparatus, is provided wherein a fine pattern is projected on the front and rear surfaces of an object to be measured via object lenses oppositely provided on the front and rear surfaces of the object to be measured in its thickness. The image of the projected pattern on the object to be measured is formed via said object lenses, and the contrast of the formed pattern image is detected. Then the object lenses are moved slightly to achieve the maximum of the contrast, or to perform an automatic focusing control. The thickness of the object to be measured can then be estimated from the difference of the positions of the object lenses at which the maximum contrast, or the focused condition, are obtained.


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