The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 1985

Filed:

Apr. 29, 1982
Applicant:
Inventors:

Yasuhiro Maeda, Sapporo, JP;

Takashi Yokoyama, Sapporo, JP;

Shinichi Yagihashi, Sapporo, JP;

Assignee:

Hoxan Corporation, Sapporo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22D / ;
U.S. Cl.
CPC ...
164118 ; 156D / ; 1566 / ; 136261 ; 427240 ;
Abstract

A method of fabricating a polycrystalline silicon wafer, which method includes the steps of radially outwardly flowing molten liquid of silicon base material on the wafer forming surface of a turntable mechanism by means of centrifugal force, thereby forming a thin molten liquid layer in a prescribed atmosphere, and cooling and solidifying the same. An apparatus for fabricating the wafer is used to carry out the method with a recover tray arranged at the wafer forming surface for receiving the excessive silicon liquid scattered, and a wafer tray placed on the recovery tray. The wafer forming surface is cooled with coolant flowing in the wafer forming mechanism. Thus, large crystalline grains can be grown on the wafer in free states with the atmosphere from the inner surfaces of the casting mold.


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