The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 1985

Filed:

Apr. 26, 1984
Applicant:
Inventors:

Minoru Yamada, Iruma, JP;

Akira Masaki, Tokyo, JP;

Masakazu Yamamoto, Kokubunji, JP;

Keiichirou Nakanishi, Kokubunji, JP;

Takashi Nishida, Tokyo, JP;

Takahiro Daikoku, Ibaraki, JP;

Fumiyuki Kobayashi, Sagamihara, JP;

Kuninori Imai, Kanagawa, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361385 ; 361386 ;
Abstract

A cooling module for integrated circuit chips comprising a plurality of integrated circuit chips mounted on a wiring substrate, cooling members respectively provided for integrated circuit chips, each of the cooling members having therein space for circulating the coolant, and flexible pipes connected to respective cooling members, the coolant being caused to flow into or out of said space of said cooling member through the flexible pipes in order to remove heat from the integrated circuit chip.


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