The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 1985
Filed:
Mar. 28, 1983
Naoaki Oishi, Machida, JP;
Noriyuki Shimizu, Saitama, JP;
Takashi Shoji, Chichibu, JP;
Shoji Harada, Asaka, JP;
Showa Denko Kabushiki Kaisha, Tokyo, JP;
Nikkan Industries Co., Ltd., Tokyo, JP;
Abstract
The present invention relates to a substrate for a printed circuit exhibiting particularly an excellent electrical insulating property, as well as an excellent heat dissipating property and heat resistance. In accordance with the present invention, a substrate of a printed circuit comprises a metallic plate, and further comprising on at least one surface of said metallic plate, a synthetic resin layer containing an inorganic filler, a heat-resistant resin film, and a synthetic resin layer, which are successively laminated on said metallic plate. A substrate of the present invention also comprises a metallic plate, at least two synthetic resin layers containing an inorganic filler, a heat-resistant resin film which is laminated between said at least two synthetic resin layers.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile