The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 1984

Filed:

Jun. 15, 1982
Applicant:
Inventors:

Rudolf A Heinecke, Harlow, GB;

Ronald C Stern, Cheshunt, GB;

Michael J Cooke, Harlow, GB;

Assignee:

ITT Industries, Inc., New York, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
118667 ; 118666 ; 118688 ; 118726 ; 118719 ; 118725 ; 118692 ; 62 555 ;
Abstract

An apparatus for depositing metal or alloy films by a thermal decomposition process on a substrate includes a furnace having a number of selectively heated zones. The temperature of each zone is controllable so as to provide compensation for changes in the concentration of reactant materials in the different regions of the furnace. Means are provided for the safe handling of highly pyrophoric organometallic reactants. The apparatus may be used for the deposition of aluminium/silicon alloy films on semiconductor wafers in the manufacture of integrated circuits.

Published as:
EP0068738A1; JPS5845373A; US4488506A; EP0068738B1; DE3278366D1; JPH0442468B2;

Find Patent Forward Citations

Heinecke, Rudolf. (1984). Metallization plant (U.S. Patent No. 4488506). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4488506

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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