The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 1984

Filed:

Jun. 06, 1983
Applicant:
Inventors:

Motohisa Miyafuji, Yamaguchi, JP;

Takashi Matsui, Shimonoseki, JP;

Hidekazu Harada, Shimonoseki, JP;

Masumitsu Soeda, Shimonoseki, JP;

Shin Ishikawa, Shimonoseki, JP;

Hiroshi Murakado, Shimonoseki, JP;

Hiroaki Kawamoto, Shimonoseki, JP;

Takeo Tabuchi, Shimonoseki, JP;

Kunio Kamada, Shimonoseki, JP;

Yasuhiro Nakashima, Shimonoseki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C / ;
U.S. Cl.
CPC ...
420481 ; 148 / ; 420482 ; 420487 ;
Abstract

A copper alloy for electric and electronic devices, comprising: 3.0-3.5 wt % of Ni, 0.5-0.9 wt % of Si, 0.02-1.0 wt % of Mn, 0.1-5.0 wt % of Zn and the balance Cu and the inevitable impurities.


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