The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 1983

Filed:

Dec. 02, 1981
Applicant:
Inventors:

Tetsuya Takayashiki, Tokyo, JP;

Taiji Usui, Tokyo, JP;

Tetsuma Sakurai, Hachioji, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
2957 / ; 2957 / ; 2957 / ; 29578 ; 29580 ; 148175 ; 156628 ; 156647 ; 156649 ; 156657 ; 357 44 ; 357 49 ; 357 56 ;
Abstract

Spaced recesses are formed in a surface of a low impurity concentration P type single-crystal substrate by using a mask. A P type impurity is diffused at a high concentration into an entire surface of the substrate including the recesses to form a P type diffused layer, and an N type layer is epitaxially grown on the P type diffused layer. Then, mask layers are formed on bottom surfaces of the recesses in the epitaxially grown N type layer and this N type layer is anisotropically etched by using the mask layers to form island regions in the recesses. After removing the mask layers, N type diffused layers are formed to cover the island regions. An insulating film (SiO.sub.2) acting to isolate completed transistor elements is formed on the P and N type diffused layers, and a polycrystalline silicon layer acting as a support of a dielectrically isolated integrated circuit device is formed on the insulating film. Then, the rear surface of the single-crystal silicon substrate is ground off to expose the insulating film. MOS or bipolar type transistor elements are formed in the island regions to obtain a dielectrically isolated semiconductor integrated device.


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