The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 1983

Filed:

Dec. 24, 1981
Applicant:
Inventors:

Krishna K Nair, Binghamton, NY (US);

Keith A Snyder, Vestal, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
427 99 ; 427250 ; 427255 ; 4272557 ; 427318 ; 427 88 ; 427 89 ; 427 91 ; 357 71 ; 2041 / ;
Abstract

A process is provided for making a multilayer integrated circuit substrate having improved via connection. A first layer M1 of chrome-copper-chrome is applied to a ceramic substrate and the circuits etched. A polyimide layer is then applied, cured, and developed and etched to provide via holes in the polyimide down to the M1 circuitry. The top chrome is now etched to expose the M1 copper in the via holes. A second layer M2 of copper-chrome is evaporated onto the polyimide at a high substrate temperature to provide a copper interface at the base of the vias having no visable grain boundaries and a low resistance. M2 circuitization is then carried out.


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