The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 1983
Filed:
Aug. 31, 1981
Kanji Murakami, Mito, JP;
Mineo Kawamoto, Hitachi, JP;
Yutaka Itoh, Takahagi, JP;
Youichi Matsuda, Hitachi, JP;
Motoyo Wajima, Hitachi, JP;
Shoji Kawakubo, Nakamachi, JP;
Toyofusa Yoshimura, Nakamachi, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A process for producing a printed circuit board which comprises forming a plating film forming adhesive layer on the whole exposed surface of an insulating board, roughening said adhesive layer surface, depositing a catalyst for electroless copper plating on said adhesive layer surface from a catalyst solution, masking the thus treated insulating board surface excepting the part where a circuit is to be formed, and then performing the electroless copper plating on the catalyst of the board to form a circuit thereon, wherein an improvement comprises treating the roughened adhesive layer surface with an alkaline solution before depositing the catalyst thereon and treating the masked insulating board with an aqueous solution containing a surfactant before performing the electroless copper plating. The above process assures a higher copper utilization and a large adhesive strength of the copper plating to the board.