The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 17, 1982

Filed:

Dec. 17, 1980
Applicant:
Inventors:

Ritsuo Matsumiya, Omiya, JP;

Mitsuaki Osawa, Omiya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05C / ;
U.S. Cl.
CPC ...
118 66 ; 118314 ; 118324 ; 118503 ; 427209 ; 430313 ;
Abstract

An apparatus for applying photo resist on both surfaces of a semiconductor wafer is disclosed. The apparatus comprises a first conveying section for successively conveying semiconductor wafers one by one, a first photo resist application section provided on the way of the conveying section, a first drying section provided on the way of said first conveying section in the order after the first photo resist application section, a second conveying section connected to said first conveying section for successively conveying semiconductor wafers one by one, a reversing section provided on the way of the second conveying section for reversing the semiconductor wafer, a third conveying section connected to said second conveying section for successively conveying semiconductor wafers one by one, a second photo resist application section provided on the way of the third conveying section, and a second drying section provided on the way of said third conveying section in the order after the second photo resist application section.


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