The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 1982
Filed:
Feb. 05, 1981
Konrad Hieber, Munich, DE;
Norbert Mayer, Munich, DE;
Siemens Aktiengesellschaft, Berlin and Munich, DE;
Abstract
Reproducible manufacture of metallic layers for semiconductor and thin film technology is attained by dynamic control of the layering process whereby the specific electrical resistance, .rho., is determined as a function of layer thickness, d, and layering parameters are regulated by a process-control computer. With this process, factors effecting the growth of a layer with respect to its structure, texture and composition are identified and calculated as measured values of .rho. and d, by the process-control computer and corrections for individual layering parameters are calculated via a suitable control program. In this manner, the nucleation of a layer and its growth is influenced in such a manner that the layer exhibits the desired electrical, structural and texture properties in its final state.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile