The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 1982
Filed:
Oct. 15, 1980
Hitoshi Oka, Yokohama, JP;
Kenji Nakamura, Fujisawa, JP;
Hitoshi Yokono, Yokohama, JP;
Tokio Isogai, Fujisawa, JP;
Akira Matsuo, Yokohama, JP;
Osamu Miyazawa, Yokosuka, JP;
Isamu Tanaka, Yokosuka, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
The pH of a chemical copper plating solution is exactly measured for a prolonged time by utilizing a copper oxide prepared by etching metallic copper in an 0.1-1 N inorganic acid then oxidizing the etched metallic copper in an aqueous 0.1-1 N alkali metal hydroxide solution as a main electrode for pH measurement or reducing agent concentration measurement in terms of pH. A combination of the pH measurement with well known procedures for measuring concentrations of cupric ions and a complexing agent exactly measures the pH and the concentrations of a reducing agent, cupric ions and a complexing agent for a continuation of longer time than the conventional procedures.