The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 1981
Filed:
May. 25, 1978
John Balyoz, Hopewell Junction, NY (US);
Chi S Chang, Wappingers Falls, NY (US);
Barry C Fox, Poughkeepsie, NY (US);
John A Palmieri, Wappingers Falls, NY (US);
Majid Ghafghaichi, Poughkeepsie, NY (US);
Teh-Sen Jen, Fishkill, NY (US);
Donald B Mooney, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Disclosed is an improved masterslice design technique including structure, wiring, and method of fabricating, to provide improved Large Scale Integrated Devices. In accordance with the improved masterslice technique a plurality of semiconductor chips are provided wherein essentially the entire semiconductor surface area of each chip is utilized to provide cells selectable to be personalized (wired). None of the semiconductor surface area is dedicated for wiring channels. The individual cell area and cell configuration is optimally arrived at to facilitate wiring the maximum number, if not all of the cells contained on each chip, whereby circuit density is materially improved and a wide variety LSI device part numbers may be readily fabricated.