The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 1980

Filed:

Dec. 30, 1977
Applicant:
Inventors:

Jerome J Cuomo, Lincolndale, NY (US);

Amitava Gangulee, Croton-on-Hudson, NY (US);

John Kobliska, Mount Kisco, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C04B / ;
U.S. Cl.
CPC ...
148 3155 ; 7512 / ; 75170 ; 148 3157 ; 428450 ;
Abstract

These amorphous metal-alloy films include nitrogen, greater than about one atomic percent at least one transition metal selected from Cr, Fe, Co and Ni with at least one element forming an amorphous alloy therewith, selected from the 'glass forming' elements, i.e., B, Si, Al, C and P. The alloys can be formed by deposition in a vacuum chamber. When films are sputtered, the target is composed of the above alloy elements with at least one element selected from each of the transition metal and glass forming element groups. Sputtering occurs in an atmosphere above about 2% vol. N.sub.2 gas mixed with an inert gas, e.g., Ar. Alloys produced include N, i.e., (Co-Fe-B)N and (Fe-B)N. Above about 2 atomic % N in the film, films have lower values of saturation magnetization 4.pi.M.sub.s. Above a 2% vol. N.sub.2 gas in the plasma, electrical resistivity increases. Over 0.5% vol. N.sub.2 gas in the plasma, the film's effective perpendicular anisotropy field H.sub.k.sup.* increases. For (Co-Fe-B)N, the anisotropy direction moves from in plane to perpendicular above 2% vol. N.sub.2 plasmas. For (Fe-B)N, H.sub.k.sup.* increases with N.sub.2 up to 10% vol. N.sub.2 plasma. The N% in a film varies linearly with the log of N.sub.2 % vol. Films show markedly improved adhesion, corrosion resistance and hardness. Magnetic thermal stability increases with N.sub.2 above about 5% vol. N.sub.2 in a plasma. Structural and magnetic properties are stable for annealing up to 400.degree. C.


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