The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 1980

Filed:

Jul. 27, 1978
Applicant:
Inventors:

Keijiro Nishida, Nimomiya, JP;

Mitsuo Kakei, Tokyo, JP;

Osamu Kamiya, Yokohama, JP;

Nobuyuki Sekimura, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
118706 ; 118 501 ; 118503 ; 118504 ; 118719 ; 118724 ; 118725 ; 118730 ; 118733 ;
Abstract

An apparatus for vacuum deposition of a thin film onto the surface of a substrate includes a vacuum container formed by a base plate, a cylindrical side wall and a top plate to accommodate at least four movable sealing caps each having a space adapted to confine a batch of substrates on a carrier of dome shape. The caps move around the center of the base plate. When the caps are stopped to cover respective openings provided through the base plate, there are established a pre-heating, a vapor depositing, a cooling and an air locking chamber, and the batch of processed substrates in the air locking chamber is moved to the outside of the apparatus without disturbing the vacuum in the container. Next, the air locking chamber, after having received a new batch of unprocessed substrates at the space of the cap thereof, is sealed from the ambient atmosphere, and all the caps are advanced one step ahead. The controlled atmosphere in the lower section of the vapor depositing chamber remains almost unchanged during this time to insure that uniform, thin-film layers of deposited material are applied to the substrates. Further, to eliminate fluctuation in quality among manufactured lots, there is provided a novel evaporant feeding mechanism.


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