Process for preparing semiconductor devices

Abstract

A process for preparing semiconductor devices by forming an insulation coating, such as a low melting point glass, on the surface of a semiconductor substrate and then forming a shaved groove through the insulation coating to the inner part of the semiconductor substrate. The insulation coating is one that is easily subject to cracking when shaved by a high speed rotating diamond blade having substantially parallel side surfaces. The low melting point glass and the semiconductor substrate are shaved by a diamond blade having a tapered edge which rotates in high speed, without forming a crack in the insulation coating or breaking a part of the semiconductor substrate. The semiconductor substrate is divided along the shaved groove in a dicing step to obtain separated semiconductor pellets.