The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 1980
Filed:
Nov. 29, 1978
Applicant:
Inventors:
William R Morcom, Melbourne Beach, FL (US);
Kenneth A Berry, Palm Bay, FL (US);
Assignee:
Harris Corporation, Melbourne, FL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
2041 / ; 2041 / ;
Abstract
A method of forming fuses and two level interconnects including applying a layer of fusible material on an insulating layer and through contact apertures, cleaning said fusible layer by sputter etching, applying a layer of metallic material by sputtering, selectively patterning the metallic layer to form a top layer of contacts and interconnects and selectively patterning the fusible layer to form fusible elements and to form a bottom layer of contacts and interconnects.
Morcom, William. (1980). Method of fabricating two level interconnects and fuse on an ic (U.S. Patent No. 4184933). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4184933
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile