The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 1979
Filed:
Apr. 05, 1978
Applicant:
Inventors:
Masao Kosugi, Hamamatsu, JP;
Takashi Ogata, Hamamatsu, JP;
Assignee:
Nippon Gakki Seizo Kabushiki Kaisha, Shizvoka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01J / ;
U.S. Cl.
CPC ...
29580 ; 29583 ; 29588 ; 148-15 ;
Abstract
On a common semiconductor wafer constituted by a PN-lamination are formed a number of semiconductor device units. Recessed grooves are formed into this wafer by an etching technique at such sites as one corresponding to the boundaries of the respective adjacent semiconductor device units. To protect the PN-junctions of the wafer exposed on the etched grooves, these surfaces are coated with a thermo-setting resin. Thereafter, the semiconductor wafer is severed apart at the respective recessed grooves into respective individual chips of semiconductor devices.