The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 1978

Filed:

Aug. 10, 1976
Applicant:
Inventors:

Hidehiko Kobayashi, Fuji, JP;

Tatsumi Arakawa, Fuji, JP;

Tetsuo Shiga, Fuji, JP;

Kaoru Ohmura, Fuji, JP;

Sakae Ito, Fuji, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K / ;
U.S. Cl.
CPC ...
428201 ; 428199 ; 428220 ; 428216 ; 427 96 ; 427 98 ; 427 43 ; 427 53 ; 427 56 ; 96 384 ; 174 685 ;
Abstract

A novel printed circuit board with a circuit of high precision having a polymer coat layer between a base and a dispersion imaging material layer and a pattern circuit on undispersed portions of the dispersion imaging material layer. Such a printed circuit board is prepared by a simplified process which comprises essentially two steps, namely, exposure of the dispersion imaging material through a circuit pattern mask to obtain a pattern circuit of the unexposed portions and conductive metal plating wherein said unexposed portions are selectively deposited with the conductive metal due to the specific effect of provision of the polymer coat layer directly under the dispersion imaging material layer.


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