The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 1978

Filed:

Dec. 02, 1976
Applicant:
Inventors:

Michael S Lombardo, Waterbury, CT (US);

Elaine F Jacovich, Cheshire, CT (US);

Eugene D D'Ottavio, Thomaston, CT (US);

John J Grunwald, New Haven, CT (US);

Assignee:

MacDermid Incorporated, Waterbury, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D / ; B32B / ;
U.S. Cl.
CPC ...
427 96 ; 156630 ; 156665 ; 156901 ; 427 98 ; 427307 ; 428418 ; 428447 ; 428450 ; 428901 ;
Abstract

An improvement is obtained in the bond strength between members of a laminate comprising a plastic substrate and a metal film through a process of first laminating to the plastic substrate a thin, sacrificial, anodized metal foil while providing at the interface prior to laminating of the foil to the plastic at least a mono molecular film of an organic silicon compound. After laminating the treated metal foil to the substrate under heat and pressure, the foil is chemically stripped from the substrate, leaving a surface of improved receptivity for conventional electroless plating and electroplating procedures, or other metallizing techniques. The final metal film when applied to the substrate exhibits consistently better adhesive strength than is obtained without the organic silicon treatment of the interface, especially in respect to adhesive strength at elevated temperature.


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