The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 1978

Filed:

Dec. 12, 1975
Applicant:
Inventors:

David E De Bar, Manassas, VA (US);

Francisco H De La Moneda, Reston, VA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 32 ; 29572 ; 29574 ;
Abstract

Variations of current gain from element to element in a phototransistor array are eliminated by covering the array with an opaque mask and etching openings in the mask over each phototransistor based upon an area reduction factor (ARF). The area reduction factor for an opening is equal to (I.sub.m /I.sub.x).sup.1-n where n is a constant definitive of the change in beta of a phototransistor in the array over a given range of collector currents; I.sub.m is the minimum collector current measured for the array and I.sub.x is the collector current for the phototransistor beneath the opening. Based upon the ARF's, the openings etched in the mask or cover initiate uniform current from each phototransistor element when uniform light flux is directed on the array. The process of fabricating the array comprises measuring the collector current for each phototransistor element at a given uniform light flux; determining the element with minimum collector current in the array; calculating the ARF for each phototransistor to achieve a uniform current response from the array; coating the array with an opaque cover, and etching the cover at each phototransistor based upon the ARF.


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