The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 1976

Filed:

Mar. 31, 1975
Applicant:
Inventor:

Walter Francis Reichert, East Brunswick, NJ (US);

Assignee:

RCA Corporation, New York, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
156-3 ; 156 13 ; 156 17 ; 156 18 ; 204 15 ; 204 23 ; 204 / ; 204 / ; 427 91 ;
Abstract

Raised electrical contacts are electroplated on selected previously metallized contacts of a semiconductor device. Each metallized contact is on a surface of a separate mesa, respectively, of the device and extends in a cantilever manner beyond the surface of the mesa. The electroplating of the raised electrical contacts is accomplished by the steps of (1) depositing a layer of a metal over the device, (2) applying a photoresist over the layer of the metal, (3) defining openings in the photoresist over areas of the metallized contacts where the raised contacts are to be formed, and (4) electroplating the raised contacts on the metallized contacts through the openings, using the layer of the metal as an electrode in an electroplating system.


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