The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 1976
Filed:
Feb. 18, 1975
Paul Lublin, Framingham, MA (US);
Donald Koffman, Winchester, MA (US);
GTE Laboratories Incorporated, Waltham, MA (US);
Abstract
An apparatus for measuring the plating thickness of a thin gold coating on a substrate such as a sheet or thin wire is described. The gold plating thickness, which may range from one to about one hundred and fifty microinches, is measured with an X-ray analysis technique in real-time as the plating of a wire is in process. The gold plated wire is exposed to X-rays of a type and intensity selected to stimulate X-ray emission from both the gold plating and the substrate with energies which permit energy-dispersive analysis. A ratio between the X-ray energies attributable to the substrate and gold plating is employed to determine the thickness of the gold plating with a generally applicable calibration curve. The accurate and rapid gold plating thickness measurement enables the monitoring the regulation of the gold plating thickness with a feedback control in a highly accurate manner.