The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 1976
Filed:
Dec. 14, 1973
John J Grunwald, Waterbury, CT (US);
Peter E Kukanskis, Naugatuck, CT (US);
Elaine F Jacovich, Cheshire, CT (US);
Eugene D D'Ottavio, Waterbury, CT (US);
MacDermid Incorporated, Waterbury, CT (US);
Abstract
Circuit boards for electronic equipment are produced in which the circuit-forming conductor metal is deposited on a suitably catalyzed and masked resin substrate by an all-additive electroless deposition technique, in which the characterizing feature is the use of a two-stage metal deposition to build up the desired total thickness of metal. In the first stage a fine grained, thin deposit of metal is produced on the substrate which is then water rinsed and immersed in a second metal bath having a sufficiently high rate of deposition to produce the desired total thickness of metal in a commercially practical period of time. Improved adhesion of plated metal to the resin substrate, both before and after thermal shock, is achieved by resort to this two-stage plating procedure.