The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 1976
Filed:
Sep. 30, 1974
Michael C Smith, Costa Mesta, CA (US);
Orthodyne Electronics, Costa Mesa, CA (US);
Abstract
The second wire bond is made in a semiconductor circuit simultaneously with breaking of the wire, in such manner that a 'tailless' wirebond is achieved in minimum time and with no damage to either the wire or the bonding pad. The bond is made ultrasonically, and tension is applied to the wire during the actual time that ultrasonic bonding energy is supplied to the bonding tool. Such tension is applied by a spring or its equivalent, and is so predetermined that application of the bonding energy to the bonding tool will not only create the ultrasonic bond but will also break the wire.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile