The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2026
Filed:
Jun. 12, 2024
United Microelectronics Corp., Hsin-Chu City, TW;
Chich-Neng Chang, Pingtung County, TW;
Fu-Yu Tsai, Tainan City, TW;
Da-Jun Lin, Kaohsiung City, TW;
Bin-Siang Tsai, Changhua County, TW;
UNITED MICROELECTRONICS CORP., Hsin-Chu City, TW;
Abstract
A through silicon via structure includes a semiconductor substrate. A via hole penetrates the semiconductor substrate. A copper layer is disposed in the via hole. A diffusion block layer is disposed in the via hole, wherein the diffusion block layer surrounds and contacts the copper layer. A silicon oxide stack is disposed in the via hole, wherein the silicon oxide stack surrounds and contacts the diffusion block layer and the silicon oxide stack contacts the semiconductor substrate. The concentration of oxygen atoms in the silicon oxide stack decreases along a direction which is from the diffusion block layer toward the semiconductor substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile