The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2026
Filed:
Aug. 29, 2024
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jaeho Hong, Suwon-si, KR;
Bongcheol Kim, Suwon-si, KR;
Taehong Min, Suwon-si, KR;
Sangjun Park, Suwon-si, KR;
Sang-Ho Yun, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
Provided is a substrate bonding apparatus including: an upper chuck including a guide hole extending in a vertical direction; a lower chuck below the upper chuck, wherein the upper chuck and the lower chuck are configured to have a plurality of overlapped substrates placed between the upper chuck and the lower chuck; a striking pin configured to be driven within the guide hole and to strike the plurality of overlapped substrates; and a buffer member below the lower chuck, wherein the buffer member is configured to buffer a striking force transmitted by the striking pin.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile