The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2026
Filed:
Dec. 29, 2023
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd., Wuhan, CN;
Guoliang Ye, Wuhan, CN;
Sheng Hu, Wuhan, CN;
Qiong Zhan, Wuhan, CN;
Jun Zhou, Wuhan, CN;
Peng Sun, Wuhan, CN;
Abstract
A dicing method, a bonding method and a die are disclosed, in the die, a protective structure is formed, which at least covers a top surface of a functional layer, and substrate dicing is carried out along the thickness of dicing lanes. By protecting the top surface of the functional layer with the protective structure, contamination of a bonding interface by particles produced during the substrate dicing process can be minimized or prevented, increasing the quality and reliability.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile