The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2026

Filed:

Aug. 18, 2023
Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventors:

Takumi Ito, Toyama, JP;

Kiyohisa Ishibashi, Toyama, JP;

Kotaro Murakami, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 14/24 (2026.01); C23C 16/24 (2006.01); C23C 16/44 (2006.01); C23C 16/455 (2006.01); H10P 14/20 (2026.01);
U.S. Cl.
CPC ...
H10P 14/24 (2026.01); C23C 16/24 (2013.01); C23C 16/4412 (2013.01); C23C 16/45561 (2013.01); C23C 16/45578 (2013.01); H10P 14/3411 (2026.01); H10P 14/3444 (2026.01);
Abstract

There is provided a technique that includes: (a) supplying a groupelement-containing gas to a substrate; and (e) performing a cycle a predetermined number of times after (a). The cycle includes: (b) supplying a dopant gas containing a halide of a groupelement or a groupelement to the substrate; (c) supplying a first reducing gas to the substrate; and (d) supplying the groupelement-containing gas to the substrate in this order.


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Ito, Takumi. (2026). Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium (U.S. Patent No. 12796345). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12796345

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