The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2026

Filed:

Dec. 29, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Hyung Keun Park, Suwon-si, KR;

Myung Soo Noh, Suwon-si, KR;

Da Woon Choi, Suwon-si, KR;

Bong Keun Kim, Suwon-si, KR;

Yun Kyoung Song, Suwon-si, KR;

Hee Jeong, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 46/00 (2026.01); G06F 30/392 (2020.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
G06F 30/392 (2020.01); H10W 46/00 (2026.01); H10W 46/301 (2026.01);
Abstract

An integrated circuit layout includes: a first chip area; and a second chip area, wherein the first chip area includes: a first main area including a first main pattern; a first mark area adjacent to the first main area, wherein a first mark pattern is formed in the first mark area; and a first dummy area including a first dummy pattern, wherein the second chip area includes: a second main area including a second main pattern; a second mark area adjacent to the second main area, wherein a second mark pattern is formed in the second mark area; and a second dummy area including a second dummy pattern, wherein the first and second mark patterns are used to check alignment states of the first chip area and the second chip area, respectively, and wherein each of the first and second mark patterns has a standard cell structure.


Find Patent Forward Citations

Quick Actions:

Park, Hyung. (2026). Integrated circuit layout and method for manufacturing integrated circuit device using the integrated circuit layout (U.S. Patent No. 12792814). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12792814

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