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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12789517 B1

PDFFull Text
Date of Patent:
Nov. 10, 2026

Filed:

Jul. 28, 2023

Method for assembling an anti-adhesive film onto a metal substrate by hot stamping

Applicant:

Seb S.a., Ecully, FR;

Inventors:

Simon Allemand, Ecully Cedex, FR;

Fabien Inclair, Ecully Cedex, FR;

Patrice Rey, Ecully Cedex, FR;

Martin Rubio, Ecully Cedex, FR;

Assignee:

SEB S.A., Ecully, FR;

Attorney:

Lerner David LLP

Primary Examiner:

Sarang Afzali

Int. Cl.
CPC ...
B21D 22/02 (2006.01); A47J 36/02 (2006.01); B23P 15/00 (2006.01); B32B 15/085 (2006.01); B32B 37/06 (2006.01); B32B 37/10 (2006.01); B32B 15/18 (2006.01); B32B 15/20 (2006.01);
U.S. Cl.
CPC ...
B32B 37/10 (2013.01); A47J 36/025 (2013.01); B21D 22/022 (2013.01); B23P 15/00 (2013.01); B32B 15/085 (2013.01); B32B 37/06 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 2311/24 (2013.01); B32B 2311/30 (2013.01); B32B 2509/00 (2013.01);
Abstract

A metal substrate having a face to be coated with a film is heated to a temperature between 350° C. and 550° C. A film comprising a layer containing 50-100% by weight polytetrafluoroethylene (PTFE) and 0-50% by weight of one or more thermoplastic polymers different from PTFE, the percentages being relative to the total weight of PTFE and the one or more thermoplastic polymers, is positioned such that the layer faces the heated face of the metal substrate. The metal substrate and film are then assembled by hot stamping, whereby the film is heated essentially by conduction upon contact with the metal substrate during assembly.

Find Patent Forward Citations

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Allemand, Simon. (2026). Method for assembling an anti-adhesive film onto a metal substrate by hot stamping (U.S. Patent No. 12789517). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12789517

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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