The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Mar. 31, 2022
Intel Corporation, Santa Clara, CA (US);
Sonja Koller, Lappersdorf, DE;
Vishnu Prasad, Munich, DE;
Bernd Waidhas, Pettendorf, DE;
Eduardo De Mesa, Munich, DE;
Lizabeth Keser, San Diego, CA (US);
Thomas Wagner, Regelsbach, DE;
Mohan Prashanth Javare Gowda, Ottobrunn, DE;
Abdallah Bacha, Munich, DE;
Jan Proschwitz, Riesa, DE;
INTEL FOUNDRY IP LLC, Santa Clara, CA (US);
Abstract
Disclosed herein are microelectronic packages having thermally conductive layers and methods for manufacturing the same. The microelectronics packages may include a substrate and a plurality of dies connected to the substrate and/or each other to form a die stack. The dies may have a perimeter. A thermally conductive layer may be located in between the respective dies. The thermally conductive layers may extend past at least a portion of the perimeters, thereby providing enhanced cooling of the die stack.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile