The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Jun. 15, 2022
Infineon Technologies Ag, Neubiberg, DE;
Christoph Liebl, Munich, DE;
Stefan Schwab, Regensburg, DE;
Adrian Lis, Regensburg, DE;
Michael Ledutke, Saal, DE;
Lisa Aschenbrenner, Kelheim, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor module includes: a chip carrier having a first side and a second, opposite side; a semiconductor chip arranged on the first side of the chip carrier; an encapsulation body that encapsulates the semiconductor chip; and at least two external contacts made of a metal or an alloy and arranged next to each other, which are electrically and mechanically connected to the first side of the first chip carrier and protrude laterally out of the encapsulation body. At least one of the external contacts has at least one wing arranged within the encapsulation body and located opposite the other external contact. The wing includes one or more cutouts that are filled with the encapsulation material of the encapsulation body.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile