The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Sep. 28, 2023
Fuji Electric Co., Ltd., Kawasaki, JP;
Naoki Hayashi, Kawasaki, JP;
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Abstract
A semiconductor module includes: a laminated substrate configured by laminating an insulating plate, a heat dissipation plate disposed on a lower surface of the insulating plate, and a circuit plate disposed on an upper surface of the insulating plate; a semiconductor element disposed on an upper surface of the circuit plate; a case that surrounds the laminated substrate and a space housing the semiconductor element; a sealing resin filling the space of the case to seal the semiconductor element; and a partition wall that extends in an up-down direction to divide the space filled with the sealing resin into a plurality of subspaces. The partition wall has a lower end and an upper end opposite to each other in the up-down direction. At least a portion of the lower end of the partition wall is connected to the upper surface of the circuit plate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile