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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12787784 B1

PDFFull Text
Date of Patent:
Nov. 03, 2026

Filed:

Jan. 13, 2023

Structure including moisture barrier along input/output opening and related method

Applicant:

Globalfoundries U.s. Inc., Malta, NY (US);

Inventor:

Zhuojie Wu, Port Chester, NY (US);

Assignee:

GlobalFoundries U.S. Inc., Malta, NY (US);

Attorneys:

Francois Pagette

Hoffman Warnick LLC

Primary Examiner:

Zandra V Smith

Assistant Examiner:

Daniel J Hibbert

Int. Cl.
CPC ...
H10W 74/43 (2026.01); G02B 6/122 (2006.01); G02B 6/30 (2006.01); G02B 6/36 (2006.01); H10W 42/00 (2026.01); H10W 74/10 (2026.01); G02B 6/12 (2006.01);
U.S. Cl.
CPC ...
H10W 42/00 (2026.01); G02B 6/122 (2013.01); G02B 6/30 (2013.01); G02B 6/3652 (2013.01); G02B 2006/12166 (2013.01);
Abstract

A structure includes an integrated circuit chip in a substrate, and an I/O opening extending inwardly from an edge of the integrated circuit chip. A dielectric moisture barrier includes a first portion extending along a side of the I/O opening, a second portion extending along the edge of the integrated circuit chip, and a third portion coupling the first moisture barrier portion to the second moisture barrier portion to complete the moisture barrier between the edge of the integrated circuit chip and the I/O opening. The third portion is distanced from the corner of the integrated circuit chip where the I/O opening meets the edge of the chip to prevent damage to the moisture barrier from fabrication processes, such as chip dicing, chip handling or other processes. Various crack stop configurations are also provided to further protect the moisture barrier from damage.

Find Patent Forward Citations

Quick Actions:

Wu, Zhuojie. (2026). Structure including moisture barrier along input/output opening and related method (U.S. Patent No. 12787784). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787784

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