The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Nov. 30, 2023
SK Keyfoundry Inc., Cheongju-si, KR;
SK keyfoundry Inc., Cheongju-si, KR;
Abstract
A method for manufacturing a semiconductor die includes forming a front side of a semiconductor wafer; etching a surface of the semiconductor wafer to a predetermined depth to form a first aperture in the front side of the semiconductor wafer; forming a protective layer on the front side of the semiconductor wafer and performing a first turning-over of the semiconductor wafer to a back side of the semiconductor wafer; exposing a bottom of the first aperture to form a second aperture in the back side of the semiconductor wafer; and performing a second turning-over of the semiconductor wafer to the front side of the semiconductor wafer and removing the protective layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile