The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Oct. 04, 2023
Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventors:

Shoma Miyata, Toyama, JP;

Kimihiko Nakatani, Toyama, JP;

Takayuki Waseda, Toyama, JP;

Yoshitomo Hashimoto, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 14/60 (2026.01); C23C 16/02 (2006.01); C23C 16/04 (2006.01); C23C 16/32 (2006.01); C23C 16/56 (2006.01); H10P 14/692 (2026.01);
U.S. Cl.
CPC ...
H10P 14/6506 (2026.01); C23C 16/0272 (2013.01); C23C 16/04 (2013.01); C23C 16/325 (2013.01); C23C 16/56 (2013.01); H10P 14/6334 (2026.01); H10P 14/6922 (2026.01);
Abstract

There is provided a technique that includes (a) forming a first adsorption-inhibiting layer by adsorbing at least a portion of a molecular structure of molecules constituting a first precursor on a surface of a first base by supplying the first precursor to a substrate including the first base and a second base on a surface of the substrate, (b) forming an adsorption-promoting layer on a surface of the second base by supplying a reactant to the substrate, (c) forming a second adsorption-inhibiting layer by adsorbing at least a portion of a molecular structure of molecules constituting a second precursor on a surface of the adsorption-promoting layer by supplying the second precursor, which is different in molecular structure from the first precursor, to the substrate, and (d) forming a film on the surface of the first base by supplying a film-forming substance to the substrate subjected to (a), (b), and (c).


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Miyata, Shoma. (2026). Processing method, method of manufacturing semiconductor device, processing apparatus, and recording medium (U.S. Patent No. 12787666). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787666

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