The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

May. 16, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Jhen-Wei Chen, Tainan, TW;

Ling-Sung Wang, Tainan, TW;

Yung-Yu Chen, Tainan, TW;

Yi-Ming Lin, Changhua, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 64/01 (2025.01); H10D 30/01 (2025.01); H10D 30/62 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01);
U.S. Cl.
CPC ...
H10D 64/021 (2025.01); H10D 30/024 (2025.01); H10D 30/6211 (2025.01); H10D 84/0147 (2025.01); H10D 84/038 (2025.01);
Abstract

A semiconductor device structure, along with methods of forming such, are described. The semiconductor device structure includes a first gate electrode, which includes a first section having a slanted sidewall and an imaginary sidewall, a second section extending radially from the imaginary sidewall of the first section, the second section has a curved bottom, and a third section extending downwardly from the first section, wherein the third section has a straight sidewall, and the slanted sidewall of the first section connects the straight sidewall of the third section to the curved bottom of the second section. The semiconductor device structure also includes a first gate dielectric layer in contact with the straight sidewall of the third section and the slanted sidewall of the first section, and a first gate spacer in contact with the first gate dielectric layer and the slanted sidewall of the first section.


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Chen, Jhen-Wei. (2026). Shape of core gate electrode of semiconductor device structure and methods of forming the same (U.S. Patent No. 12787401). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787401

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