The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Mar. 14, 2022
Applicant:

Hitachi High-tech Corporation, Tokyo, JP;

Inventors:

Kyohei Horikawa, Tokyo, JP;

Takamasa Ichino, Tokyo, JP;

Shintarou Nakatani, Tokyo, JP;

Kazunori Nakamoto, Tokyo, JP;

Yuki Tanaka, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H05B 3/56 (2006.01); H10P 72/72 (2026.01);
U.S. Cl.
CPC ...
H01J 37/32724 (2013.01); H01J 37/3299 (2013.01); H05B 3/56 (2013.01); H10P 72/722 (2026.01); H01J 2237/334 (2013.01);
Abstract

An electrostatic chuckhas a heater HTand a heater HTeach covered by dielectric filmsto. The heater HTis divided into a region HThaving a circular shape in plan view, a region HTsurrounding an outer periphery of the region HTin plan view, and a region HTsurrounding an outer periphery of the region HTin plan view. The heater HTis divided into a plurality of regions HT, each having a rectangular shape in plan view. The regions HTto HTand the plurality of regions HTare electrically connected to a control unit C. The control unit Cis configured to individually control supply of power to the regions HTto HTand the plurality of regions HT


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Horikawa, Kyohei. (2026). Plasma processing apparatus (U.S. Patent No. 12785051). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12785051

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