The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2026
Filed:
May. 10, 2024
Amkor Technology Singapore Holding Pte. Ltd., Valley Point, SG;
Dae Young Park, Jeollanam-do, KR;
Hyeong Il Jeon, Gyeonggi-do, KR;
Gi Jeong Kim, Gyeonggi-do, KR;
Ji Yeon Yang, Gyeonggi-do, KR;
Kwang Soo Sang, Incheon, KR;
Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;
Abstract
An electronic device includes an embedded module including a module component comprising a first terminal and a second terminal. A first module substrate is coupled to the first terminal with a first bonding layer and a second module substrate is coupled to the second component terminal with a second bonding layer. A module encapsulant covers the module component and the first and second module substrates. A first device substrate is coupled to the first module substrate and a second device substrate is coupled to the second module substrate. Device terminals are coupled to the module component and a device encapsulant covers the embedded module, the device terminals, and the first and second device substrates. The first bonding layer includes a first sintering material, the second bonding layer includes a second sintering material, and portions of the first device substrate and the device terminals are exposed from the device encapsulant.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile