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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12777941 B1

PDFFull Text
Date of Patent:
Oct. 27, 2026

Filed:

Oct. 12, 2023

Wire bond electromagnetic interference (emi) cage to block transmission and receipt of emi at an optical emissions component

Applicant:

Stmicroelectronics International N.v., Geneva, CH;

Inventors:

Kai Quan Cheng, Singapore, SG;

Tat Ming Teo, Singapore, SG;

Andrew John Price, Bonnyrigg, GB;

William Halliday, Edinburgh, GB;

Bhagya Prakash Bandusena, Singapore, SG;

Calum Ritchie, Glasgow, GB;

Assignee:

STMICROELECTRONICS INTERNATIONAL N.V., Geneva, CH;

Attorney:

Alston & Bird LLP

Primary Examiner:

Dale E Page

Assistant Examiner:

Quovaunda undefined Jefferson

Int. Cl.
CPC ...
H10W 42/20 (2026.01); H10W 72/50 (2026.01);
U.S. Cl.
CPC ...
H10W 42/20 (2026.01); H10W 72/536 (2026.01); H10W 72/5363 (2026.01);
Abstract

An example apparatus and optical emission device for preventing the transmission of electromagnetic radiation to and from targeted electrical components of an electronic device are provided. The example apparatus may include an optical emissions component electrically connected to a target electrical portion and configured to generate an optical output. The example apparatus may further include a wire bond electromagnetic interference cage configured to block the passage of electromagnetic emissions. The wire bond electromagnetic interference cage may include a plurality of bond wires, wherein each bond wire is electrically coupled to an electrical ground, and wherein the wire bond electromagnetic interference cage overlays at least a portion of the target electrical portion. In addition, the wire bond electromagnetic interference cage may further define an electromagnetic interference cage opening through which the optical output passes.

Find Patent Forward Citations

Cheng, Kai. (2026). Wire bond electromagnetic interference (emi) cage to block transmission and receipt of emi at an optical emissions component (U.S. Patent No. 12777941). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12777941

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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