The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2026
Filed:
Aug. 08, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Shih-Wei Peng, Hsinchu, TW;
Jiann-Tyng Tzeng, Hsin Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A method for fabricating an integrated circuit includes forming a first pattern metal layer comprising a plurality of metal tracks extending in a first direction. Each of the plurality of metal tracks is separated from its adjacent one of the plurality of metal tracks by a first pitch. The method further includes forming a second pattern metal layer formed over the first pattern metal layer. The second pattern metal layer comprises a second plurality of metal tracks extending in the first direction. Each of the second plurality of metal tracks is separated from its adjacent one of the second plurality of metal tracks by a second pitch. The method further includes forming a third pattern metal layer disposed between the first pattern metal layer and the second pattern metal layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile