The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

May. 16, 2024
Applicant:

Nanya Technology Corporation, New Taipei City, TW;

Inventors:

Jian-Ping Wu, New Taipei City, TW;

Jui-Hsiu Jao, New Taipei City, TW;

Assignee:

NANYA TECHNOLOGY CORPORATION, New Taipei City, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 74/00 (2026.01); H10P 54/00 (2026.01); H10W 46/00 (2026.01);
U.S. Cl.
CPC ...
H10P 74/277 (2026.01); H10P 54/00 (2026.01); H10W 46/00 (2026.01); H10W 46/503 (2026.01);
Abstract

A semiconductor device and method for manufacturing the same are provided. The semiconductor device includes a first active region, a second active region, a first testing module, and a second testing module. The second active region is separated by the first active region by a scribe line. The scribe line extends along a first direction. The first testing module abuts the first active region and is disposed within the scribe line. The second testing module abuts the second active region and is disposed within the scribe line. The first testing module and the second testing module are arranged along a second direction substantially orthogonal to the first direction.


Find Patent Forward Citations

Quick Actions:

Wu, Jian-Ping. (2026). Semiconductor device having testing module disposed within scribe line and method for manufacturing the same (U.S. Patent No. 12777898). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12777898

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